Lime Connect Scholarships - US and Canada

Home >> Careers with a Business Degree >> Careers with an Accounting Degree >> Scholarships >> Lime Connect Scholarships Us Canada
About this Award: 

Lime Connect is leading the way as the premier resource for top talent in the disability space by attracting, preparing and connecting highly accomplished individuals with disabilities for careers with the world’s leading corporations.

 

Lime Connect hosts a variety of outstanding scholarship programs with their corporate partners - some of which include a paid internship to get you started on a great career.  All scholarships are awarded based on merit - not financial need, and students do not need to be registered with disability services/access centres on campus nor do they need to provide proof of disability.

 

Amount: 

Varies ($2,500 - $10,000) - Some include paid internship opportunities 

 

Number of Awards Available: 

Multiple

 

Deadline: 

September 30, 2018

 

Region of Study: 

Canada; United States

 

Level of Study: 

Undergraduate; Graduate

 

Eligibility : 

Lime Connect scholarship programs are meant for students with a visible or invisible disability (defined as someone who has, or considers themselves to have, a long-term, or recurring, issue that impacts one or more major activities that others may consider to be a daily function); this definition also includes the perception among others that a disability exists. As 90% of disabilities on campus are invisible, and candidates with all disabilities are encouraged to apply.

 

Although specific eligibility criteria varies by award, universal criteria includes:

 

• Pursuing coursework related to business, computer science, actuarial science, statistics, information technology, or closely related fields

• Exemplify leadership and demonstrate a commitment to and passion for chosen field

• Maintaining a strong academic performance

• Please visit the website for specific eligibility criteria for each individual scholarship

 

Application Instructions: 

For specific application instructions, please visit the link below.

 

Contact email: